<p><strong><span>英国伦敦、美国</span></strong><strong><span>圣克拉拉</span></strong><strong><span>，</span></strong><strong><span lang="EN-US">2020</span></strong><strong><span>年</span></strong><strong><span lang="EN-US">10</span></strong><strong><span>月</span></strong><strong><span lang="EN-US">20</span></strong><strong><span>日</span></strong><span lang="EN-US"> – </span><span>领先的</span><span>电池和电源管理、</span><span lang="EN-GB">Wi-Fi</span><span>、低功耗蓝牙（</span><span lang="EN-GB">BLE</span><span>）、工业边缘计算解决方案供应商</span><span lang="EN-US"><a href="http://www.dialog-semiconductor.com/"><span lang="EN-GB">Dialog</span><span lang="EN-US"><span lang="EN-US">半导体</span></span><span lang="EN-US"><span lang="EN-US">公司</span></span></a></span><span>（<span>德国证券交易所交易代码</span>：</span><span lang="EN-US"><a href="http://www.dialog-semiconductor.com/investor-relations"><span lang="EN-GB">DLG</span></a></span><span>）和全球领先特殊工艺半导体代工厂</span><span lang="EN-US"><a href="https://www.globalfoundries.com/"><span lang="EN-US"><span lang="EN-US">格芯</span></span><span>® (G</span><span>LOBALFOUNDRIES®)</span></a></span><span>今天联合宣布，已就</span><span lang="EN-US">Dialog</span><span>向格芯授权导电桥接</span><span lang="EN-US">RAM</span><span>（</span><span lang="EN-US">CBRAM</span><span>）技术达成协议。</span><span>该基于电阻式</span><span lang="EN-US">RAM</span><span>（</span><span lang="EN-US">ReRAM</span><span>）的技术由</span><span lang="EN-US">Dialog</span><span>半导体公司于</span><span lang="EN-US">2020</span><span>年收购的</span><span lang="EN-US">A</span><span lang="EN-US">desto Technologies</span><span>首创。格芯首先将在其</span><span lang="EN-US">22FDX®</span><span>平台上</span><span>以嵌入式非易失性存储器（</span><span lang="EN-US">NVM</span><span>）选项提供</span><span lang="EN-US">Dialog</span><span>的</span><span lang="EN-US">CBRAM</span><span>，后续计划将该技术拓展到其他平台。</span></p>
<p><span lang="EN-US">Dialog</span><span>独有的且经过生产验证的</span><span lang="EN-US">CBRAM</span><span>技术是一项低功耗的</span><span lang="EN-US">NVM</span><span>解决方案，专为物联网（</span><span lang="EN-US">IoT</span><span>）、</span><span lang="EN-US">5G</span><span>连接、人工智能（</span><span lang="EN-US">AI</span><span>）等一系列应用而设计。低功耗、高读</span><span lang="EN-US">/</span><span>写速度、更低的制造成本、对恶劣环境的耐受能力使</span><span lang="EN-US">CBRAM</span><span>特别</span><span>适合消费、医疗、和特定的工业及汽车等应用。此外，</span><span lang="EN-US">CBRAM</span><span>技术为这些市场中的产品所需的先进技术节点提供了具成本效益的嵌入式</span><span lang="EN-US">NVM</span><span>。</span></p>
<p><span lang="EN-US">Dialog</span><span>半导体公司企业发展高级副总裁兼工业混合信号业务部总经理</span><span lang="EN-US">Mark Tyndall</span><span>表示：“</span><span lang="EN-US">CBRAM</span><span>是</span><span lang="EN-US">Adesto</span><span>杰出的标志性存储技术之一，该技术加入到</span><span lang="EN-US">Dialog</span><span>产品组合中具有重要的战略意义。此次与格芯的授权合作恰好证明了</span><span lang="EN-US">Dialog</span><span>和</span><span lang="EN-US">Adesto</span><span>融合后开展业务的速度。展望未来，我对我们和格芯牢固的合作关系非常有信心。此次授权协议不仅为行业提供了最先进的技术，也为</span><span lang="EN-US">Dialog</span><span>在下一代系统级芯片（</span><span lang="EN-US">SoC</span><span>）中采用先进</span><span lang="EN-US">CBRAM</span><span>技术提供了机遇。<span lang="EN-US">”</span></span></p>
<p><span>格芯高级副总裁兼汽车、工业和多市场业务部总经理</span><span lang="EN-US">Mike Hogan</span><span>表示：“我们与</span><span lang="EN-US">Dialog</span><span>的合作彰显了格芯在为客户进一步提供差异化优势和增值的领域加大投资的承诺。</span><span lang="EN-US">Dialog</span><span>的</span><span lang="EN-US">ReRAM</span><span>技术是对我们领先的</span><span lang="EN-US">eNVM</span><span>解决方案系列非常好的补充。该存储器解决方案结合我们的</span><span lang="EN-US">FDX</span><span>平台，将帮助我们客户进一步突破技术边界，提供新一代安全的</span><span lang="EN-US">IoT</span><span>和边缘</span><span lang="EN-US">AI</span><span>应用。</span><span>”</span></p>
<p><span lang="EN">Dialog</span><span>的</span><span lang="EN">CBRAM</span><span>技术克服了</span><span lang="EN">Re</span><span lang="EN">RAM</span><span>常见的集成和可靠性挑战，提供了可靠且低成本的嵌入式存储器，同时保留了</span><span lang="EN">ReRAM</span><span>的低电压运行能力。这意味着可以实现比标准嵌入式闪存更低功耗的读写操作。</span></p>
<p><span lang="EN">CBRAM</span><span>将于</span><span lang="EN">2022</span><span>年在</span><span lang="EN-US">22FDX</span><span>平台上以嵌入式</span><span lang="EN">NVM</span><span>选项供格芯的客户使用。通过</span><span lang="EN-US">IP</span><span>定制，客户可以修改</span><span lang="EN-US">CBRAM</span><span>单元以优化其</span><span lang="EN-US">SoC</span><span>设计，提升安全性，或对单元进行调整以适合新的应用。此外，</span><span lang="EN-US">CBRAM</span><span>作为一种“后道工序”技术，可以相对容易地集成到其他技术节点中。</span></p>
<p><span>了解更多有关</span><span lang="EN-US">Dialog CBRAM</span><span>技术，敬请</span><span>浏览网页：</span><span lang="EN-US"><a href="https://www.dialog-semiconductor.com/products/memory/cbram-technology">…;
<p><span>了解更多有关格芯</span><span lang="EN-US">22FDX</span><span>平台，敬请浏览网页：</span><span lang="EN-US"><a href="https://www.globalfoundries.com/technology-solutions/cmos/fdx/22fdx"><s…;
<p><strong><span>敬请关注：</span></strong></p>
<p><span lang="EN-US">Dialog</span><span>官方微信：</span><span lang="EN-US">Dialog_Semiconductor</span></p>
<p><span lang="EN-US">Dialog</span><span>官方微博：</span><span lang="EN-US"><a href="http://weibo.com/dialogsemi"><span>http://weibo.com/dialogsemi</span></…;
<p><strong><span>关于</span></strong><strong><span lang="EN-US">Dialog</span></strong><strong><span>半导体公司</span></strong></p>
<p><span lang="EN-US">Dialog</span><span>半导体公司是推动物联网和工业</span><span lang="EN-US">4.0</span><span>应用发展的领先标准和定制集成电路（</span><span lang="EN-US">IC</span><span>）供应商。</span><span lang="EN-US">Dialog</span><span>提供电池和电源管理、低功耗蓝牙（</span><span lang="EN-US">BLE</span><span>）、</span><span lang="EN-US">Wi-Fi</span><span>、闪存和可配置混合信号</span><span lang="EN-US">IC</span><span>等经市场验证的产品技术，帮助客户产品提升功率效率、缩短充电时间，并不断提高性能和生产效率。</span></p>
<p><span lang="EN-US">Dialog</span><span>采用无晶圆厂运营模式，作为雇主积极承担社会责任，开展各项活动造福员工、社区、其他相关利益方和自然环境。凭借数十年的技术经验和世界领先的创新实力，我们帮助设备制造商引领未来。我们对技术创新的热情和创业精神使我们始终在高能效半导体技术领域保持领先地位，助力物联网、移动、计算和存储、智慧医疗和汽车市场的发展。</span><span lang="EN-US">Dialog</span><span>半导体公司总部位于英国伦敦附近，在全球设有销售、研发和</span><span>市场</span><span>营销办事处。</span><span lang="EN-US">2019</span><span>年，</span><span lang="EN-US">Dialog</span><span>实现了约</span><span lang="EN-US">14</span><span>亿美元营业收入，并一直是发展最快的欧洲上市半导体公司之一。目前，公司在全球约有</span><span lang="EN-US">2300</span><span>名员工。公司在德国法兰克福（</span><span lang="EN-US">FWB: DLG</span><span>）证券交易所上市（</span><span lang="EN-US">Regulated Market, Prime Standard, ISIN GB0059822006</span><span>）。</span></p>
<p><span>了解更多详情，敬请访问公司官网：</span><span lang="EN-US"><a href="http://www.dialog-semiconductor.com"><span>www.dialog-semiconductor.com…;。</span></p>
<p><strong><span>关于格芯</span></strong></p>
<p><span>格芯</span><span lang="EN-US">®</span><span>（</span><span lang="EN-US">GLOBALFOUNDRIES®</span><span>）是全球领先的特殊工艺半导体代工厂，提供差异化、功能丰富的解决方案，赋能其客户为高增长的市场领域开发创新产品。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球客户的动态需求。格芯为阿布扎比穆巴达拉投资公司（</span><span lang="EN-US">Mubadala Investment Company</span><span>）所有。如需了解更多信息，请访问</span><span lang="EN-US"><a href="http://www.globalfoundries.com.cn"><span>www.globalfoundries.com.cn</sp…;。</span></p>