<p><strong>英国伦敦和加州圣克拉拉，</strong><strong><span lang="EN-US">2020</span></strong><strong><span>年</span></strong><strong><span lang="EN-US">10</span></strong><strong><span>月</span></strong><strong><span lang="EN-US">19</span></strong><strong><span>日</span></strong><span lang="EN-US"> -- </span>电池和电源管理、<span lang="EN-US">Wi-Fi®</span><span>和蓝牙</span><span lang="EN-US">®</span><span>低能耗</span><span lang="EN-US">(BLE)</span><span>以及工业边缘计算解决方案的领先供应商</span><span lang="EN-US"><a href="https://www.dialog-semiconductor.com/"><span>DIALOG SEMICONDUCTOR</span></a></span><span>（</span><span lang="EN-US">XETRA</span>代码：<span lang="EN-US"><a href="https://www.dialog-semiconductor.com/investor-relations"><span>DLG</spa…;）与全球领先的特殊工艺半导体代工厂<span lang="EN-US"><a href="https://www.globalfoundries.com/"><span lang="EN-US"><span lang="EN-US">格芯</span></span></a></span><span lang="EN-US">®</span><span>（</span><span lang="EN-US">GLOBALFOUNDRIES®</span><span>，</span><span lang="EN-US">GF®</span><span>）今日宣布，双方已达成协议，</span><span lang="EN-US">Dialog</span><span>将其导电桥接</span><span lang="EN-US">RAM (CBRAM)</span><span>技术授权给格芯</span><span lang="EN-US">®</span><span>（</span><span lang="EN-US">GLOBALFOUNDRIES®</span><span>）。这种阻性</span><span lang="EN-US">RAM(ReRAM)</span><span>技术由</span><span lang="EN-US">Adesto Technologies</span><span>公司开创，该公司最近被</span><span lang="EN-US">Dialog Semiconductor</span><span>收购。格芯</span><span lang="EN-US">®</span><span>（</span><span lang="EN-US">GLOBALFOUNDRIES®</span><span>）将首先在其</span><span lang="EN-US">22FDX®</span><span>平台上提供</span><span lang="EN-US">Dialog</span><span>的</span><span lang="EN-US">CBRAM</span><span>技术，作为嵌入式非易失性存储器</span><span lang="EN-US">(NVM)</span><span>选项，并计划扩展到其他平台。</span></p>
<p><span lang="EN-US">Dialog</span><span>经过生产验证的专有</span><span lang="EN-US">CBRAM</span><span>技术是一种低功耗</span><span lang="EN-US">NVM</span><span>解决方案，旨在支持物联网、</span><span lang="EN-US">5G</span><span>连接、人工智能</span><span lang="EN-US">(AI)</span><span>等一系列应用。</span><span lang="EN-US">CBRAM</span><span>具备低功耗、高读</span><span lang="EN-US">/</span><span>写速度、低制造成本以及对恶劣环境的耐受性，因此特别适合消费电子、医疗以及部分工业和汽车应用。此外，</span><span lang="EN-US">CBRAM</span><span>技术还能为这些市场的产品所需的先进技术节点提供高性价比的嵌入式</span><span lang="EN-US">NVM</span><span>。</span></p>
<p><span lang="EN-US">Dialog Semiconductor</span><span>企业发展高级副总裁兼工业混合信号业务部总经理</span><span lang="EN-US">Mark Tyndall</span><span>表示：“</span><span lang="EN-US">CBRAM</span><span>是</span><span lang="EN-US">Adesto</span><span>标志性存储器技术之一，也是</span><span lang="EN-US">Dialog</span><span>产品组合的颠覆性新产品。与格芯建立新的授权合作关系，体现了</span><span lang="EN-US">Dialog</span><span>和</span><span lang="EN-US">Adesto</span><span>携手开创新事业的迅捷速度。</span></p>
<p><span>展望未来，我非常看好我们与格芯的紧密合作关系。这项协议不仅能够为行业提供先进的技术，而且还使</span><span lang="EN-US">Dialog</span><span>有机会在下一代片上系统</span><span lang="EN-US">(SoC)</span><span>采用领先的</span><span lang="EN-US">CBRAM</span><span>技术。”</span></p>
<p><span>格芯高级副总裁兼汽车、工业和多市场总经理</span><span lang="EN-US">Mike Hogan</span><span>表示：“我们与</span><span lang="EN-US">Dialog</span><span>的合作关系表明，格芯致力于加大投资力度，进一步为客户提供差异化的增值产品。</span><span lang="EN-US">Dialog</span><span>的</span><span lang="EN-US">ReRAM</span><span>技术为我们领先的</span><span lang="EN-US">eNVM</span><span>解决方案系列提供了有力补充。该存储器解决方案与我们的</span><span lang="EN-US">FDX™</span><span>平</span><span>台相结合，能够帮助我们的客户推陈出新，提供新一代安全物联网和边缘人工智能应用。”</span></p>
<p><span lang="EN-US">Dialog</span><span>的</span><span lang="EN-US">CBRAM</span><span>技术克服了</span><span lang="EN-US">ReRAM</span><span>经常面临的集成与可靠性挑战，提供了可靠的低成本嵌入式存储器，同时支持</span><span lang="EN-US">ReRAM</span><span>在低电压下工作。这意味着需要比标准嵌入式闪存产品写入和读取访问耗能更低。</span></p>
<p><span lang="EN-US">CBRAM</span><span>将于</span><span lang="EN-US">2022</span><span>年作为格芯</span><span lang="EN-US">22FDX</span><span>平台的嵌入式</span><span lang="EN-US">NVM</span><span>选项投入生产，供格芯客户使用。客户可以借助</span><span lang="EN-US">IP</span><span>定制服务，对</span><span lang="EN-US">CBRAM</span><span>单元进行修改，以优化其</span><span lang="EN-US">SoC</span><span>设计，增强安全性，甚至调整单元以满足新应用的需求。此外，作为“后端制程”技术，</span><span lang="EN-US">CBRAM</span><span>更容易集成到其他技术节点。</span></p>
<p><span>如需了解更多关于</span><span lang="EN-US">Dialog CBRAM</span><span>技术的信息，请点击</span><span lang="EN-US"><a href="https://www.dialog-semiconductor.com/products/memory/cbram-technology">… lang="EN-US"><span lang="EN-US">此处</span></span></a></span><span>。</span></p>
<p><span>如需了解更多关于格芯</span><span lang="EN-US">®</span><span>（</span><span lang="EN-US">GLOBALFOUNDRIES®</span><span>）</span><span lang="EN-US">22FDX</span><span>平台的信息，请点击</span><span lang="EN-US"><a href="https://www.globalfoundries.com/technology-solutions/cmos/fdx/22fdx"><s… lang="EN-US"><span lang="EN-US">此处</span></span></a></span><span>。</span></p>
<p><strong><span>关于格芯</span></strong></p>
<p><span>格芯是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务。伴随着全球生产基地横跨三大洲的发展步伐，格芯促生了改变行业的技术和系统的出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司（</span><span lang="EN-US">Mubadala Investment Company</span><span>）所有。欲了解更多信息，请访问</span><span lang="EN-US"><a href="https://www.globalfoundries.com/cn"><span>https://www.globalfoundries.c…;。</span></p>
<p><strong><span>关于</span></strong><strong><span lang="EN-US">Dialog Semiconductor</span></strong></p>
<p><span lang="EN-US">Dialog Semiconductor</span><span>是领先的标准和定制集成电路</span><span lang="EN-US">(IC)</span><span>供应商，用于物联网和工业</span><span lang="EN-US">4.0</span><span>应用。</span><span lang="EN-US">Dialog</span><span>凭借成熟的专业技术，提供电池管理、蓝牙</span><span lang="EN-US">®</span><span>低能耗、</span><span lang="EN-US">Wi-Fi</span><span>、闪存和可配置混合信号</span><span lang="EN-US">IC</span><span>，以推动下一代设备的发展，提高电源效率，减少充电时间，同时提高性能和生产力。</span></p>
<p><span lang="EN-US">Dialog</span><span>采用无晶圆厂的商业模式，作为有社会责任感的雇主，推行了多项福利计划，以造福员工、社区、其他利益相关者和经营环境。我们凭借数十年的经验和先进的创新，帮助制造商实现下一个目标。凭借对创新的热忱和创业精神，我们始终站在物联网、移动、计算和存储、互联医疗和汽车市场的高能效半导体技术的前沿。</span><span lang="EN-US">Dialog</span><span>总部位于伦敦附近，销售、研发和营销组织覆盖全球。</span><span lang="EN-US">2019</span><span>年，营业收入约为</span><span lang="EN-US">14</span><span>亿美元，持续名列欧洲增长最快的上市半导体公司之一。目前，它在全球拥有约</span><span lang="EN-US">2,300</span><span>名员工。该公司在法兰克福（</span><span lang="EN-US">FWB</span><span>代码：</span><span lang="EN-US">DLG</span><span>）证券交易所（受监管市场，主要标准，</span><span lang="EN-US">ISIN GB0059822006</span><span>）上市。</span></p>
<p><span>如需了解更多信息，请访问</span><span lang="EN-US"><a href="http://www.dialog-semiconductor.com"><span>www.dialog-semiconductor.com…;。</span></p>