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<p><em>CISSOID高温芯片和模块技术亦将大力推动电动汽车动力总成的深度整合</em></p>

<p><span>CISSOID<span>&nbsp;</span></span><span>日前宣布</span><span>推出了一种基于轻质</span><span>AlSiC</span><span>平板基板(</span><span>Flat Base</span><span>p</span><span>late)</span><span>的三相碳化硅（</span><span>SiC</span><span>）</span><span>MOSFET</span><span>智能功率模块（</span><span>IPM</span><span>），</span><span>以</span><span>满足航空和其他特殊工业应用中</span><span>针对</span><span>自然</span><span>空气</span><span>对流或</span><span>背板</span><span>冷却的需求。</span><span>此项高温芯片和模块技术平台亦将大力推动电动汽车动力总成系统（电机、电控及变速箱</span><span>)</span><span>的深度整合</span><span>,</span><span>以使其体积、重量及相应成本大幅降低，并实现最佳能源效率</span><span>。</span></p>

<p><span>C</span><span>ISSOID的</span><span>IPM</span><span>技术平台</span><span>可迅速</span><span>适应</span><span>新的</span><span>电压、功率</span><span>和冷却要求</span><span>，极</span><span>大地加速了基于SiC的功率</span><span>转换</span><span>器的</span><span>设计</span><span>，从而</span><span>实现</span><span>了高效率和高功率密度。嵌入式</span><span>栅级驱动</span><span>器解决了与快速</span><span>开关</span><span>SiC晶体管有</span><span>关</span><span>的多个挑</span><span>战</span><span>：</span><span>例如用</span><span>负驱动</span><span>和有源米勒</span><span>钳</span><span>位（AMC）</span><span>来</span><span>防止寄生</span><span>导</span><span>通；</span><span>去饱</span><span>和</span><span>检测（De</span><span>SAT</span><span>）</span><span>和</span><span>软关</span><span>断（SSD）可以快速</span><span>且</span><span>安全地</span><span>应对</span><span>短路事件。</span><span>栅极驱动</span><span>器上的欠</span><span>压锁</span><span>定（UVLO）和DC</span><span>总线电压监视</span><span>系</span><span>统</span><span>以确保</span><span>正常</span><span>运</span><span>行</span><span>，</span><span>等等</span><span>。</span></p>

<p><span>新的</span><span>风冷模块</span><span><span>&nbsp;</span>(CMT-PLA3SB340AA和CMT-PLA3SB340CA)<span>&nbsp;</span></span><span>系</span><span>专为无法使用液体冷却的应用而设计，例如航空机电执行器和功率转换器</span><span>等等</span><span>。该模块的额定阻断电压为</span><span>1200V，最大</span><span>连续电流为</span><span>340A</span><span>；导通电阻仅有</span><span>3.25m</span><span>Ω，而开关损耗仅为分别为</span><span>8.42mJ和7.05mJ</span><span>（</span><span>在</span><span>600V</span><span><span>&nbsp;</span></span><span>300A</span><span><span>&nbsp;</span>条件下</span><span>）</span><span>。</span><span>该功率模块的额定结温为</span><span>175°C，而</span><span>栅极驱动器的额定环境温度为</span><span>125°C</span><span>，通过</span><span>AlSiC扁平底板冷却</span><span>，热阻较低、</span><span>耐</span><span>热性强</span><span>。</span></p>

<p><span>C</span><span>ISSOID 首席技术官</span><span><span>&nbsp;</span>Pierre Delatte<span>&nbsp;</span></span><span>指出，“</span><span>C</span><span>ISSOID 实现了功率</span><span>模块和栅极驱动器的</span><span>整体</span><span>融合设计，</span><span>且</span><span>可通过仔细调整</span><span>dv/dt</span><span>去实现</span><span>控制</span><span>，通过</span><span>快速切</span><span>换所固有的电压过冲来优化</span><span>IPM，从而将</span><span>开关能量</span><span>损耗</span><span>降至最低。</span><span>该</span><span>模块的安全运行区域（</span><span>RBSOA）允</span><span>许</span><span>直流</span><span>总线电压高达</span><span>880V</span><span>、峰值电流高达</span><span>600A，从而使</span><span>得</span><span>800V</span><span>电池</span><span>电压系统的应用</span><span>是绝对安全的。”</span></p>

<p><span>“</span><span>C</span><span>ISSOID提供的高温芯片和模块技术，已在石油钻探等领域内的长期应用中得到了充分的验证，</span><span>可以满足</span><span>业内</span><span>最苛刻</span><span>的应用</span><span>需求。</span><span>此次推出</span><span>的新型</span><span>SiC智能</span><span>功率</span><span>模块瞄准了航空和其他特殊工业应用，特别针对其中紧凑轻便的功率转换器</span><span>所要求</span><span>的自然对流或</span><span>背板</span><span>冷却而设计。</span><span>之前，我们已推出采用</span><span>针翅</span><span>基板</span><span>（Pin</span><span><span>&nbsp;</span>Fin Baseplate</span><span>）</span><span>的</span><span>新</span><span>型</span><span>液冷</span><span>IPM</span><span>功率模块</span><span>（</span><span>CXT</span><span>－</span><span>PLA3SA450AA</span><span>），</span><span>此次我们还推出了</span><span>具有</span><span>更高电流能力的</span><span>针翅基板</span><span>，以及</span><span>液冷</span><span>IPM</span><span>功率模块</span><span>（</span><span>CXT－PLA3SA550CA）</span><span>，</span><span>以针对电动汽车市场的初期需求。我们相信</span><span>C</span><span>ISSOID 独特的耐高温技术平台将大力推动电动汽车动力总成系统的深度整合。</span><span><span>&nbsp;</span></span><span>”</span><span>CISSOID首席执行官Dave Hutton表示</span><span>。</span></p>

<p><span>“此外，</span><span>C</span><span>ISSOID</span><span><span>&nbsp;</span>IPM<span>&nbsp;</span></span><span>智能功率模块除采用了国际上最流行的</span><span>SiC MOSFET</span><span>芯片外，我们也与中国国内的</span><span>SiC</span><span>芯片厂商开展深入合作，</span><span>也</span><span>相继推出了基于</span><span>中国</span><span>国产</span><span>SiC MOSFET</span><span>的</span><span>IPM</span><span>模块</span><span>（</span><span>CXT</span><span>－</span><span>PLA3SA550CA 和</span><span><span>&nbsp;</span></span><span>CMT</span><span>－</span><span>PLA3SB340CA</span><span>）</span><span>；这些</span><span>中国</span><span>国产版的S</span><span>iC</span><span><span>&nbsp;</span></span><span>IPM</span><span>模块一方面适应了中国国内的市场需求，另一方面亦促进了与国内半导体产业链的共同发展。”H</span><span>utton</span><span>先生补充道。</span></p>

<p><span>Yole Development的市场调查报告表明，自硅功率半导体器件诞生以来，应用需求一直推动着结温的升高，目前已达到150℃。</span><span>第三代</span><span>宽禁带</span><span>半导体器件（如SiC）已走过了</span><span>从出现发展到已</span><span>日趋成熟并全面商业化普及的路径，其独特的耐高温性</span><span>能正在推动结温加速从目前的150℃迈向175℃，未来将进军200℃。借助于SiC的独特高温特性和低开关损耗优势，这一结温不断提升的趋势</span><span>将大大改变电力系统的设计格局。这些目前典型的、未来还将出现的高温、</span><span>高功率密度</span><span>应用，包括深度整合的电动汽车动力总成、多电和全电飞机乃至电动飞机、移动储能充电站和充电宝，以及其他各种液体冷却受到严重限制的电力应用。</span></p>

<p><span>更多信息，请访问：</span><a href="https://www.cissoid.com/sic-power-modules/"><strong>https://www.cissoid…;

<p><span>关于</span><span>C</span><span>ISSOID</span><span><span>&nbsp;</span>-<span>&nbsp;</span></span><a href="http://www.cissoid.com/"><span>www.cissoid.com</span></a></p&gt;

<p><span>CISSOID公司是</span><span>各个行业中所需</span><span>高温半导体解决方案的领导者。</span></p>

<p><span>专注于汽车领域，我们可提供高效的功率转换和精巧的电机驱动方案：适用于</span><span>SiC和 GaN<span>&nbsp;</span></span><span>开关管的高压门级驱动，具低电感及增强热性能的功率模块，以及超越</span><span>AEC-Q100 0级质量标准的</span><span>175°C</span><span>工作温度的汽车级元器件。</span></p>

<p><span>面向航空、工业和石油及天然气市场，我们</span><span>专为极端温度与恶劣环境</span><span>提供</span><span>信号调节、</span><span>电机控制、时钟及</span><span>电源管理</span><span>方面的</span><span>解决方案。</span><span>CISSOID产品性能可靠，可在-55</span><span>℃～</span><span><span>&nbsp;</span>+225℃</span><span>温度范围的条件下长期工作。</span></p>